Image sensor driving mechanism

ABSTRACT

An image sensor driving mechanism includes a fixed assembly, a movable assembly, and a driving assembly. The movable assembly includes a circuit component. The circuit component includes a circuit main body and a movable suspension arm. The circuit main body is configured to hold an image sensor. The movable suspension arm is elastically connected to the circuit main body and the fixed assembly. The image sensor is electrically connected to the fixed assembly via the circuit component. The image sensor extends in a direction that is perpendicular to the optical axis. The drive assembly is configured to drive the movable assembly to move relative to the fixed assembly. The movable suspension arm includes a section that extends in a different direction than the optical axis.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/703,147, filed Jul. 25, 2018, and China Patent Application No.201910492357.9, filed Jun. 6, 2019, the entirety of which areincorporated by reference herein.

BACKGROUND OF THE INVENTION Field of the Invention

The application relates in general to a driving mechanism, and inparticular, to an image sensor driving mechanism.

Description of the Related Art

With technology has progressed, camera modules have come to be widelyapplied in portable electronic devices such as cell phones and tabletcomputers. In general, a camera module has a lens and an image sensor.Incident light can fall on the image sensor via the lens, and the imagesensor generates an image signal according the incident light. For thecamera module to achieve high image quality, the camera module utilizesa drive motor to adjust the position of the lens, thus facilitatingauto-focus and auto-zoom control of the camera module.

Moreover, in most cases, when a user takes photographs using theportable electronic apparatus, it is mostly held by hand. In general,the image captured by the portable electronic apparatus can be blurrywhen there is insufficient light. In order to prevent the abovedeficiency, optical image stabilization is added to the camera module ofthe prior art.

However, although conventional camera modules have generally beenadequate for their intended purposes, they have not been entirelysatisfactory in all respects. Consequently, it is desirable to provide asolution for improving optical image stabilization of camera modules.

BRIEF SUMMARY OF INVENTION

The image sensor driving mechanism of the present disclosure canprecisely move the image sensor to provide a well optical shakingcompensation, and the image sensor can obtain a high quality image.

An embodiment of the present application provides an image sensordriving mechanism, including a fixed assembly, a first movable assembly,and a first driving assembly. The fixed assembly includes a frame. Thefirst movable assembly includes a circuit component. The circuitcomponent includes a circuit main body and a movable suspension arm. Thecircuit main body is configured to hold an image sensor. The movablesuspension arm is elastically connected to the circuit main body and thefixed assembly. The image sensor is electrically connected to the fixedassembly via the circuit component. The image sensor extends in adirection that is perpendicular to the optical axis. The first driveassembly is configured to drive the first movable assembly to moverelative to the fixed assembly.

The movable suspension arm includes a first section, which extends in adifferent direction than the optical axis and is electrically connectedto the image sensor. The movable suspension arm can move relative to thecircuit main body and the fixed assembly. The frame has a frame surface,facing the first movable assembly and perpendicular to the optical axis.The frame surface has a through hole corresponding to the image sensor,and a gap is formed between the frame surface and the first movableassembly.

In some embodiments, the image sensor driving mechanism further includesa second movable assembly and a second driving assembly. The secondmovable assembly is movably disposed in the fixed assembly andconfigured to hold an optical member. The second driving assembly isconfigured to drive the second movable assembly to move relative to thefixed assembly along a first direction. The frame surface is disposedbetween the second movable assembly and the first movable assembly.

In some embodiments, the first movable assembly further comprises aholder, disposed on the circuit component and surrounding the imagesensor. The holder has a receiving portion, configured to receive aportion of the circuit component.

In some embodiments, the movable suspension arm further comprises aconnecting portion connected to the circuit main body and the firstsection. The extending direction of the connecting portion is differentthan the extending direction of the first section, wherein a portion ofthe connecting portion is accommodated in the receiving portion.

In some embodiments, the image sensor is disposed between the circuitcomponent and the frame surface. The first driving assembly is disposedon the peripheral area of the first movable assembly.

In some embodiments, the width of the first section is greater than thethickness of the first section, the width is measured along a directionparallel to the optical axis, and the thickness is measured along adirection that is perpendicular to the optical axis.

In some embodiments, the circuit component has a circuit componentsurface, continuously arranged on the circuit main body and the firstsection. The circuit component surface on the circuit main body facesthe image sensor, and the circuit component surface on the first sectionis parallel to the optical axis.

In some embodiments, the circuit component further comprises a secondsection. The extending direction of the second section is different thanthe extending direction of the first section.

In some embodiments, the first section is disposed on the peripheralarea of the first movable assembly, and the first section and the firstmovable assembly partially overlap as seen from a direction that isperpendicular to the optical axis.

In some embodiments, the image sensor driving mechanism furthercomprises an additional first section. The first section and theadditional first section are disposed on two sides of the first movableassembly.

In some embodiments, the circuit component further comprises a pluralityof second sections disposed on the two sides of the first movableassembly, and the extending directions of the second sections aredifferent than the extending direction of the first section.

In some embodiments, the fixed assembly further comprises a case. Thecase has a lateral wall parallel to the optical axis. The lateral walland the circuit component partially overlap as seen from a directionparallel to the optical axis.

In some embodiments, the image sensor driving mechanism furthercomprises a position detecting assembly, configured to detect themovement of the first movable assembly relative to the fixed assembly.

In some embodiments, the image sensor driving mechanism furthercomprises a second movable assembly and a second driving assembly. Thesecond movable assembly is configured to hold an optical member. Thesecond movable assembly is movably connected to the fixed assembly. Thesecond driving assembly is configured to drive the second movableassembly to move relative to the fixed assembly. The position detectingassembly has a magnetic force sensor, disposed on the first movableassembly and corresponding to a driving magnetic member of the seconddriving assembly. In some embodiments, the driving magnetic member isdisposed on the fixed assembly.

In summary, in the image sensor driving mechanism of the presentdisclosure, owing to the circuit component, the first driving assemblycan precisely move the image sensor, so as to provide a well opticalshaking compensation, and the image sensor can obtain a high qualityimage.

BRIEF DESCRIPTION OF DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a perspective view of an electronic device in accordance withsome embodiments of the present disclosure;

FIG. 2 is a perspective view of an image sensor driving mechanism inaccordance with some embodiments of the present disclosure;

FIGS. 3A and 3B are exploded views of the image sensor driving mechanismin accordance with some embodiments of the present disclosure, whereinFIG. 3B is a continued drawing of FIG. 3A;

FIG. 4 is a cross-sectional view of the image sensor driving mechanismin accordance with some embodiments of the present disclosure;

FIG. 5 is an exploded view of the first movable assembly in accordancewith some embodiments of the present disclosure;

FIG. 6 is a perspective view of the first movable assembly in accordancewith some embodiments of the present disclosure;

FIG. 7 is a perspective view of the first driving assembly in accordancewith some embodiments of the present disclosure; and

FIG. 8 is an exploded view of the circuit component and the firstdriving assembly in accordance with some embodiments of the presentdisclosure.

DETAILED DESCRIPTION OF INVENTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the present disclosure.Specific examples of components and arrangements are described below tosimplify the present disclosure. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact.

The words, such as “first” or “second”, in the specification are for thepurpose of clarity of description only, and are not relative to theclaims or meant to limit the scope of the claims. In addition, termssuch as “first feature” and “second feature” do not indicate the same ordifferent features.

Spatially relative terms, such as upper and lower, may be used hereinfor ease of description to describe one element or feature'srelationship to other elements or features as illustrated in thefigures. The spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. Moreover, the shape, size,thickness, and angle of inclination depicted in the drawings may not bedrawn to scale or may be simplified for clarity of discussion; thesedrawings are merely intended for illustration.

The terms “about” and “substantially” typically mean +/−20% of thestated value, more typically +/−10% of the stated value and even moretypically +/−5% of the stated value. The stated value of the presentdisclosure is an approximate value. When there is no specificdescription, the stated value includes the meaning of “about” or“substantially”.

FIG. 1 is a perspective view of an electronic device μl in accordancewith some embodiments of the present disclosure. The electronic deviceA1 can be a portable electronic device (such as a smartphone, a tabletcomputer, or a laptop computer), a wearable electronic device (such as asmart watch), or a vehicle-type electronic device (such as a drivingrecorder). In this embodiment, the electronic device A1 is a smartphone.

The electronic device A1 includes an outer housing A10, a display panelA20, and at least one camera module A30. The outer housing A10 can be aplate structure. The display panel A20 is disposed on a display surfaceA11 of the outer housing A10, and configured to display an image.

The camera module A30 is disposed in the outer housing A10, andcorresponds to a light hole A12 of the outer housing A10. The cameramodule A30 generates image signals according to the light falling on thecamera module A30 via the light hole A12. The display panel A20 displaysan image according to the image signals. In some embodiments, the cameramodule A30 has a zoom function and an image stabilization function.

For clarity, there are one light hole A12 and one camera module A30 areillustrated in the figures of the present disclosure. In someembodiments, the electronic device A1 has a plurality of light holes A12disposed on the rear surface A13 and/or the display surface A11 of theouter housing A10 and a plurality of camera modules A30 corresponding tothe light holes A12.

FIG. 2 is a perspective view of an image sensor driving mechanism 1 inaccordance with some embodiments of the present disclosure. FIGS. 3A and3B are exploded views of the image sensor driving mechanism 1 inaccordance with some embodiments of the present disclosure, wherein FIG.3B is a continued drawing of FIG. 3A, and a lower elastic member 42 issituated above a frame 13. FIG. 4 is a cross-sectional view of the imagesensor driving mechanism 1 in accordance with some embodiments of thepresent disclosure. For clarity, an optical member L1 is not shown inFIG. 4. The camera module A30 includes the image sensor drivingmechanism 1, the optical member L1, and an image sensor L2. The imagesensor driving mechanism 1 can be configured to move the optical memberL1 along the optical axis AX1. Furthermore, the image sensor drivingmechanism 1 can be configured to rotate or move the image sensor L2 on aplane that is perpendicular to the optical axis AX1. In someembodiments, the image sensor driving mechanism 1 can move the imagesensor L2 along the optical axis AX1 or a first direction D1. Theoptical axis AX1 is parallel to the first direction D1.

In this embodiment, the optical member L1 includes one or more lensesL11. The optical axis AX1 passes the center of the lenses L11 of theoptical member L1. The lenses L11 can extend in a direction that isperpendicular to the optical axis AX1. The image sensor L2 can be aplate structure, and can extend in a direction that is perpendicular tothe optical axis AX1. When the image sensor L2 is in an initialposition, the optical axis AX1 passes the center of the image sensor L2,and extends along a direction that is perpendicular to a sensing surfaceL21 of the image sensor L2.

In this embodiment, the incident light can pass the optical member L1along the optical axis AX1 and fall on the image sensor L2. Since theoptical member L1 of the image sensor driving mechanism 1 can move alongthe optical axis AX1, the incident light can focus on the image sensorL2 through the lenses L11. After receiving the incident light, the imagesensor L2 can transform the incident light into an electric signal(image signal) via photoelectric conversion.

As shown in FIGS. 3A, 3B, and 4, the image sensor driving mechanism 1includes a fixed assembly 10, a first movable assembly 20, a firstdriving assembly 30, a second movable assembly 40, and a second drivingassembly 50. The first movable assembly 20 is elastically connected tothe fixed assembly 10, and configured to hold the image sensor L2. Thefirst driving assembly 30 is disposed on the fixed assembly 10, andconfigured to drive the first movable assembly 20 to move (rotate and/orshift) relative to the fixed assembly 10. In other words, the firstdriving assembly 30 can rotate or shift the image sensor L2 relative tothe fixed assembly 10. Owing to the first movable assembly 20 and thefirst driving assembly 30, the optical image stabilization function canbe provided to the image sensor driving mechanism 1 (camera module A30).

The second movable assembly 40 can be movably disposed in the fixedassembly 10, and configured to hold the optical member L1. The seconddriving assembly 50 is disposed in the fixed assembly 10, and configuredto drive the second movable assembly 40 to move relative to the fixedassembly 10 along the first direction D1. In other words, the seconddriving assembly 50 can drive the optical member L1 to shift relative tothe fixed assembly 10 along the first direction D1. Owing to the secondmovable assembly 40 and the second driving assembly 50, the zoomfunction can be provided to the image sensor driving mechanism 1 (cameramodule A30).

In this embodiment, the fixed assembly 10 includes a bottom plate 11, acase 12, and a frame 13. The bottom plate 11 can be a circuit board. Insome embodiments, the bottom plate 11 can be a flexible printed circuit(FPC). The bottom plate 11 extends in a direction that is perpendicularto the first direction D1. A plurality of electrical connectors E1 and aplurality of electronic members E2 can be disposed on the bottom plate11, and electrically connected to the bottom plate 11. For example, theelectronic members E2 can include a chip, a resistance, and/or acapacitance, but it is not limited thereto.

The case 12 is disposed on the bottom plate 11. In some embodiments, thecase 12 can be affixed to the bottom plate 11. Moreover, the case 12 canbe made by metal, so as to prevent the image sensor L2 being disturbedby the electromagnetic wave.

The frame 13 can be disposed in the case 12. In some embodiments, theframe 13 can be affixed in the case 12 and situated on the bottom plate11. The frame 13 can be made of a rigid insulation material, such ashard plastic. The frame can be an annular structure surrounding theoptical axis AX1. The frame 13 can extend on a plane that isperpendicular to the optical axis AX1.

In this embodiment, the frame 13 has a first frame surface 131 (framesurface), a second frame surface 132, and a first through hole (throughhole) 133. The first frame surface 131 and the second frame surface 132extend in a direction that is perpendicular to the optical axis AX1, anddisposed between the first movable assembly 20 and the second movableassembly 40. The first frame surface 131 faces the first movableassembly 20, and the second frame surface 132 faces the second drivingassembly 50.

The first through hole 133 passes through the first frame surface 131and the second frame surface 132. In other words, the first framesurface 131 and the second frame surface 132 have the first through hole133. Furthermore, the first through hole 133 corresponds the imagesensor L2, and the optical axis AX1 passes through the center of thefirst through hole 133.

As shown in FIG. 4, a gap G1 is formed between the first frame surface131 and the first movable assembly 20. In some embodiments, the gap F1can be an air layer or a vacuum layer. In other words, the first movableassembly 20 is separated from the frame 13.

In this embodiment, the gap G1 can avoid the first movable assembly 20impacting the frame 13 during the first movable assembly 20 movesrelative to the frame 13. Furthermore, owing to the gap G1, the imagesensor driving mechanism 1 can include the first movable assembly 20,the first driving assembly 30, the second movable assembly 40, and/orthe second driving assembly having different dimensions and design.

FIG. 5 is an exploded view of the first movable assembly 20 inaccordance with some embodiments of the present disclosure. The firstmovable assembly 20 includes a circuit component 21 and a holder 22. Thecircuit component 21 is elastically connected to the fixed assembly 10and configured to hold the image sensor L2. The image sensor L2 can beaffixed to the circuit component 21, and electrically connected to thecircuit component 21 and the bottom plate 11. In other words, the imagesensor L2 is electrically connected to the bottom plate 11 of the fixedassembly 10 via the circuit component 21. In this embodiment, thecircuit component 21 is a trimmed and bended flexible printed circuit.

The circuit component 21 includes a circuit main body 211 and aplurality of movable suspension arms 212. The circuit main body 21extends in a direction that is perpendicular to the optical axis AX1.When the first movable assembly 20 is in the initial position, theoptical axis passes the center of the circuit main body 211. The imagesensor L2 is affixed to the circuit main body 211 and electricallyconnected thereto, and disposed between the circuit main body 211 andthe first frame surface 131. The circuit component 21 further includes aplurality of electronic members 218 disposed on the circuit main body211. For example, the electronic members 218 can include a chip, aresistance, and/or a capacitance, but it is not limited thereto.

An end of each of the movable suspension arms 212 is connected to thecircuit main body 211, and the other end of each of the movablesuspension arms 212 is connected to the bottom plate 11 via theelectrical connector E1. The movable suspension arms 212 are radiallydisposed on the circuit main body 211 centered on the optical axis AX1.As seen from the first direction D1, the movable suspension arms 212surround the circuit main body 211. When the first movable assembly 20shifts, the movable suspension arms 212 can move relative to the circuitmain body 211 and the fixed assembly 10.

In this embodiment, the circuit component 21 has two movable suspensionarms 212, but it is not limited thereto. In some embodiments, thecircuit component 21 has one movable suspension arm 212. In someembodiments, the circuit component 21 has three, four, or more movablesuspension arms 212. Each of the movable suspension arms 212 includes aconnecting portion 213, a first section 214, a second section 215, and amounting portion 216. The image sensor L2 is electrically connected tothe bottom plate 11 via the circuit main body 211, the connectingportion 213, the first section 214, the second section 215, the mountingportion 216, and the electrical connector E1 in sequence.

The connecting portion 213 is connected to the circuit main body 211 andthe first section 214. In this embodiment, the connecting portion 213can be a bending structure. Moreover, the connecting portion 213 can beL-shape. The connecting portion 213 has a first region 2131 and a secondregion 2132. The first region 2131 is connected to the circuit main body211 and the second region 2132. The first region 2131 can be a platestructure. When the first movable assembly 20 is in the initialposition, the first region 2131 substantially extends in the firstdirection D1, and the second region 2132 substantially extend in asecond direction D2. The second direction D2 is perpendicular to thefirst direction D1.

The first section 214 extends in a different direction than the opticalaxis AX1, and is electrically connected to the image sensor L2. In thisembodiment, when the first movable assembly 20 is in the initialposition, the first section 214 extends in a third direction D3. Thethird direction D3 is perpendicular to the first direction D1 and thesecond direction D2. Since the connecting portion 213 does not extend inthe third direction D3, the extending direction of the first section 214is different than that of the connecting portion 213.

In this embodiment, the circuit component 21 has two first sections 214,but it is not limited thereto. Two first sections 214 are disposed ontwo sides or the opposite sides of the first movable assembly 20. Inthis embodiment, the holder 22 is disposed between two first sections214, and two first sections 214 are parallel. Furthermore, the firstsections 214 can be disposed on the peripheral area of the first movableassembly 20 (holder 22).

FIG. 6 is a perspective view of the first movable assembly 20 inaccordance with some embodiments of the present disclosure. As shown inFIG. 6, as seen from a direction that is perpendicular to the opticalaxis AX1 (second direction D2), the first section 214 and the firstmovable assembly 20 are partially overlapped. In this embodiment, asseen from a direction that is perpendicular to the optical axis AX1(second direction D2), the first section 214 and the holder 22 areoverlapped.

In this embodiment, the width W1 of the first section 214 is greaterthan the thickness W2 of the first section 214. The width W1 is measuredalong a direction parallel to the optical axis AX1 (first direction D1),and the thickness W2 is measured along a direction that is perpendicularto the optical axis AX1 (second direction D2). In other words, thedimensions of the first section 214 on a direction parallel to theoptical axis AX1 (first direction D1) is greater than the dimensions ofthe first section 214 on a direction that is perpendicular to theoptical axis AX1.

The second section 215 is connected to the first section 214 and themounting portion 216. The second section 215 and the first section 214are extended toward different directions. In this embodiment, the secondsection 215 extends in the second direction D2, and perpendicular to thefirst section 214.

In this embodiment, the circuit component 21 has two second sections215, but it is not limited thereto. Two second sections 215 are disposedon two sides or the opposite sides of the first movable assembly 20. Inthis embodiment, the holder 22 is disposed between two second sections215, and two second sections 215 are parallel. Furthermore, the secondsections 215 can be disposed on the peripheral area of the first movableassembly 20 (holder 22).

As shown in FIG. 6, as seen from a direction that is perpendicular tothe optical axis AX1 (second direction D3), the second section 215 andthe first movable assembly 20 are partially overlapped. In thisembodiment, as seen from a direction that is perpendicular to theoptical axis AX1 (second direction D3), the second section 215 and theholder 22 are overlapped.

Owing to the first section 214 and the second section 215, theplasticity and the durability of the circuit component 21 can beincreased. Moreover, since two movable suspension arms 212 aresymmetrical, the first movable assembly 20 can maintain balance duringthe first driving assembly 30 drives the first movable assembly 20 tomove.

The mounting portion 216 is connected to the second section 215 and theelectrical connector E1. As shown in FIG. 4, the mounting portion 216extends in a direction that is perpendicular to the first direction D1.The mounting portion 216 is disposed on the opposite sides of the case12. In this embodiment, the mounting portion 216 can pass the case 12and be disposed outside the case 12. The case has a lateral wall 121parallel to the optical axis AX1. As seen from a direction parallel tothe optical axis AX1 (first direction D1), the lateral wall 121 and thecircuit component 21 (mounting portion 216) are partially overlapped.

In this embodiment, the circuit component 21 can well transmit the imagesignal generated by the image sensor L2 to the bottom plate 11. Aportion of the circuit component 21 is elastic due to its design.Therefore, the interference of the circuit component 21 during the firstdriving assembly 30 drives the image sensor L2 to move relative to thefixed assembly 10 can be reduced due to the design of the movablesuspension arms 212. The accuracy of the movement or the rotation of theimage sensor L2 driven by the first driving assembly 30 can be enhanced.

In this embodiment, the circuit main body 211, the connecting portion213, the first section 214, the second section 215, and the mountingportion 216 can be integrally formed as one piece. The circuit component21 has a circuit component surface 217 continuously arranged on thecircuit main body 211, the connecting portion 213, the first section214, the second section 215, and the mounting portion 216. The circuitcomponent surface 217 on the circuit main body 211 faces the imagesensor L2, or can be connected to the image sensor L2. The circuitcomponent surface 217 on the first section 214 is parallel to theoptical axis AX1. The circuit component surface 217 on the secondsection 215 is parallel to the optical axis AX1. The circuit componentsurface 217 on the mounting portion 216 is perpendicular to the opticalaxis AX1. In this embodiment, owing to the design of the integrallyformed circuit component 21, its mechanical strength and the conveniencefor manufacturing can be enhanced.

The holder 22 is disposed on the circuit main body 211 of the circuitcomponent 21 and the image sensor L2, and situated outside the case 12.In this embodiment, the holder 22 is affixed to the circuit main body211 and surrounds the image sensor L2. The holder 22 can be an annularstructure surrounding the optical axis AX1. The holder 22 can extend ona plane that is perpendicular to the optical axis AX1. The holder 22 canbe made of a rigid insulation material, such as hard plastic.

In this embodiment, the holder 22 is configured to hold a lighttransmissive plate L3. In some embodiments, the light transmissive plateL3 can be a transparent protecting plate, and can be made by glass oracrylic. In some embodiments, the light transmissive plate L3 can be anoptical filter, which can used to filter a component in the light. Forexample, the light transmissive plate L3 can filter the invisiblecomponent in light (such as the infrared radiation or the ultraviolet),but it is not limited thereto. In some embodiments, the lighttransmissive plate L3 is not disposed on the holder 22.

The holder 22 has a second through hole 221 (through hole) and areceiving portion 222. The second through hole 221 can pass through theholder 22 along the first direction D1. When the first movable assembly20 is in the initial position, the optical axis AX1 passes the center ofthe second through hole 221. Furthermore, the light transmissive plateL3 and the image sensor L2 can be disposed in the second through hole221, and the light transmissive plate L3 can be separated from the imagesensor L2.

The receiving portion 222 is formed on the lateral wall of the holder22. In this embodiment, the receiving portion 222 is separated from thesecond through hole 221. The receiving portion 222 is configured toreceive a portion of the circuit component 21. In this embodiment, aportion of the connecting portion 213 is accommodated in the receivingportion 222. Owing to the holder 22 and the receiving portion 222, theminiaturization design of the image sensor driving mechanism 1 can beachieved, and the circuit component 21 can be protected.

The first driving assembly 30 is disposed between the circuit component21 of the first movable assembly 20 and the bottom plate 11, andsituated outside the case 12. As shown in FIG. 4, the first drivingassembly 30 can be disposed on the peripheral area of the first movableassembly 20.

FIG. 7 is a perspective view of the first driving assembly 30 inaccordance with some embodiments of the present disclosure. FIG. 8 is anexploded view of the circuit component 21 and the first driving assembly30 in accordance with some embodiments of the present disclosure. Thefirst driving assembly 30 includes a first driving base 31, a seconddriving base 32, and a plurality of biasing wires 33. The first drivingbase 31 is affixed to the bottom plate 11 of the fixed assembly 10 (asshown in FIG. 3B). In this embodiment, the first driving base 31 can bean annular structure surrounding the optical axis AX1. The first drivingbase 31 can extend on a plane that is perpendicular to the optical axisAX1.

The second driving base 32 is shiftably and rotatably disposed on thefirst driving base 31. In other words, the second driving base 32 canshift and/or rotate relative to the first driving base 31. In thisembodiment, the second driving base 32 can be an annular structuresurrounding the optical axis AX1. The second driving base 32 can extendon a plane that is perpendicular to the optical axis AX1. Furthermore,the circuit main body 211 of the circuit component 21 can be disposed onthe second driving base 32. In this embodiment, the circuit main body211 can be affixed to the second driving base 32.

A first end 331 of each of the biasing wires 33 is connected to thefirst driving base 31, and a second end 332 of each of the biasing wires33 is connected to the second driving base 32. The connectingrelationship between the biasing wires 33 and the first and seconddriving bases 31 and 32 can include various different designs, and isnot limited to the disclosure in the embodiment.

In this embodiment, the biasing wires 33 can be made by shape memoryalloys (SMA). For example, the biasing wires 33 can include atitanium-nickel (TiNi) alloy, a titanium-palladium (TiPd) alloy, atitanium-nickel (TiNiCu) alloy, a titanium-nickel-palladium (TiNiPd)alloy, or a combination thereof, but it is not limited thereto.Therefore, when a power is applied to the biasing wire 33, the length ofthe biasing wire 33 changes. For example, the temperature of the biasingwire 33 becomes higher when the voltage is higher, and the length of thebiasing wire 33 shortens when the temperature of the biasing wire 33becomes higher.

Since the first end 331 and the second end 332 of the biasing wire 33are respectively connected to the first driving base 31 and the seconddriving base 32, the biasing wire 33 can provide a pulling force to move(shift or rotate) the second driving base 32 relative to the firstdriving base 31 when the biasing wire 33 shortens. Therefore, themagnitude of the pulling force can be adjusted by adjusting the voltageapplied on the biasing wire 33, so as to rotate the second driving base32 to a predetermined position.

Since the image sensor L2 is disposed on the circuit main body 211 ofthe circuit component 21, and the circuit main body 211 is disposed onthe second driving base 32, the second driving base 32 can drive theimage sensor L2 to move together. Owing to the first driving assembly 30and the first movable assembly 20, the image sensor driving mechanism 1(camera module A10) can include image stabilization and compensationfunctions.

The second movable assembly 40 is disposed on the frame 13 and situatedinside the case 12. The second movable assembly includes a carrier 41, alower elastic member 42, and an upper elastic member 43. The carrier 41is disposed on the frame 13, and can move along the optical axis AX1relative to the case 12 and the frame 13. The carrier 41 is configuredto hold the optical member L1. In this embodiment, the carrier 41 can bemade of a rigid insulation material, such as hard plastic. The carrier41 can be an annular structure surrounding the optical axis AX1. Thecarrier 41 can extend on a plane that is perpendicular to the opticalaxis AX1.

The carrier 41 has a third through hole 411 (through hole). The thirdthrough hole 411 passes through the carrier 41 along the first directionD1, and the optical axis AX1 passes the center of the third through hole411. The third through hole 411 corresponds to the first through hole133 and the second through hole 221. The third through hole 411, thefirst through hole 133, and the second through hole 221 are arrangedalong the optical axis AX1 in sequence. Furthermore, the optical memberL1 can be disposed in the third through hole 411, so that the opticalmember L1, the light transmissive plate L3, and the image sensor L2 canbe arranged along the optical axis AX1 in sequence.

The lower elastic member 42 is elastically connected to the frame 13 andthe carrier 41. The upper elastic member 43 is elastically connected tothe case 12 and the carrier 41. The carrier 41 is disposed between thelower elastic member 42 and the upper elastic member 43. The lowerelastic member 42 and the upper elastic member 43 can be flat springs,and are configured to provide an elastic force between the fixedassembly 10 and the carrier 41. After the second driving assembly 50drives the carrier 41 to shift relative to the fixed assembly 10 alongthe optical axis AX1, the upper elastic member 43 and the lower elasticmember 42 can resume the carrier 41 to its initial position.

The second driving assembly 50 is disposed in the case 12, and situatedbetween the case 12 and the carrier 41. The second driving assembly 50is configured to drive the carrier 41 to shift relative to the case 12and the frame 13 along the first direction D1. The second drivingassembly 50 includes one or more driving coils 51 and a plurality ofdriving magnetic members 52. The driving coils 51 are disposed on thecarrier 41 and corresponded to the driving magnetic members 52. In thisembodiment, the driving coils 51 surround the outer wall of the carrier41. The driving magnetic members 52 are affixed to the inner side of thecase 12, and separated from the driving coils 51 and the carrier 41.

In this embodiment, the image sensor driving mechanism 1 includes fourdriving magnetic members 52, but it is not limited thereto. The drivingmagnetic members 52 can be permanent magnets. The driving coils 51 cancreate a magnetic field by providing a current to the driving coils 51,and a magnetic force can be generated between the driving coils 51 andthe driving magnetic members 52. The aforementioned magnetic force candrive the carrier 41 to shift relative to the case 12 and the frame 13along the optical axis AX1.

As shown in FIG. 4, the second driving assembly 50 further includes aplurality of horizontal driving coils 53. The horizontal driving coils53 can be affixed to the frame 13, and situated between the drivingmagnetic members 52 and the frame 13. The horizontal driving coils 53can create a magnetic field by providing a current to the horizontaldriving coils 53, and a magnetic force can be generated between thehorizontal driving coils 53 and the driving magnetic members 52. Theaforementioned magnetic force can drive the carrier 41 to shift relativeto the case 12 and the frame 13 along a direction that is perpendicularto the optical axis AX1 (such as the second direction D2 or the thirddirection D3).

In this embodiment, owing to the second driving assembly 50, the opticalimage stabilization of the image sensor driving mechanism 1 (cameramodule A30) can become better. Therefore, when the optical member L1deviates due to shaking or swaying, it can provide a well opticalshaking compensation, so as to obtain a high quality image.

As shown in FIGS. 3A, 3B, and 4, the image sensor driving mechanismfurther includes a position detecting assembly 60 configured to sensingthe movement of the first movable assembly 20 relative to the fixedassembly 10. In this embodiment, the position detecting assembly 60 hasa magnetic force sensor 61 disposed on the first movable assembly. Inthis embodiment, the magnetic force sensor 61 can be disposed on thecircuit main body 211 of the first movable assembly 20 and electricallyconnected thereto. The magnetic force sensor 61 corresponds to thedriving magnetic member 52 of the second driving assembly 50.

Since the driving magnetic member 52 is affixed to the fixed assembly10, the magnetic force sensor 61 can generate a distance signalcorresponding to the change of the detected magnetic force from thedriving magnetic member 52 when the distance between the first movableassembly 20 and the fixed assembly 10 changes. Therefore, the imagesensor driving mechanism 1 can precisely detect the movement of thefirst movable assembly 20 according to the distance signal. Furthermore,since the position detecting assembly 60 uses the driving magneticmember 52 of the second driving assembly 50 to generate the distancesignal, the component of the position detecting assembly 60 can bereduced, so as to achieve the purpose of miniaturization.

In summary, in the image sensor driving mechanism of the presentdisclosure, owing to the circuit component, the first driving assemblycan precisely move the image sensor, so as to provide a well opticalshaking compensation, and the image sensor can obtain a high qualityimage.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. For example, it will be readily understood by thoseskilled in the art that many of the features, functions, processes, andmaterials described herein may be varied while remaining within thescope of the present disclosure. Moreover, the scope of the presentapplication is not intended to be limited to the particular embodimentsof the process, machine, manufacture, compositions of matter, means,methods and steps described in the specification. As one of ordinaryskill in the art will readily appreciate from the disclosure of thepresent disclosure, processes, machines, manufacture, compositions ofmatter, means, methods, or steps, presently existing or later to bedeveloped, that perform substantially the same function or achievesubstantially the same result as the corresponding embodiments describedherein may be utilized according to the present disclosure. Accordingly,the appended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps. Moreover, the scope of the appended claims should beaccorded the broadest interpretation so as to encompass all suchmodifications and similar arrangements.

What is claimed is:
 1. An image sensor driving mechanism, comprising: afixed assembly, comprising a frame; a first movable assembly,comprising: a circuit component, comprising a circuit main body and amovable suspension arm, wherein the circuit main body is configured tohold an image sensor, and the movable suspension arm is elasticallyconnected to the circuit main body and the fixed assembly, wherein theimage sensor is electrically connected to the fixed assembly via thecircuit component, and perpendicular to an optical axis; and a firstdriving assembly, configured to drive the first movable assembly to moverelative to the fixed assembly, wherein the suspension arm comprises afirst section, the first section extends in a different direction thanthe optical axis and is electrically connected to the image sensor, andthe movable suspension arm can move relative to the circuit main bodyand the fixed assembly, wherein the frame has a frame surface facing thefirst movable assembly and perpendicular to the optical axis, the framesurface has a through hole corresponding to the image sensor, and a gapis formed between the frame surface and the first movable assembly. 2.The image sensor driving mechanism as claimed in claim 1, furthercomprising: a second movable assembly, movably disposed in the fixedassembly and configured to hold an optical member; and a second drivingassembly, configured to drive the second movable assembly to moverelative to the fixed assembly along a first direction, wherein theframe surface is disposed between the second movable assembly and thefirst movable assembly.
 3. The image sensor driving mechanism as claimedin claim 1, wherein the first movable assembly further comprises aholder, disposed on the circuit component and surrounding the imagesensor, wherein the holder has a receiving portion configured to receivea portion of the circuit component.
 4. The image sensor drivingmechanism as claimed in claim 3, wherein the movable suspension armfurther comprises a connecting portion connected to the circuit mainbody and the first section, and the extending direction of theconnecting portion is different than the extending direction of thefirst section, wherein a portion of the connecting portion isaccommodated in the receiving portion.
 5. The image sensor drivingmechanism as claimed in claim 1, wherein the image sensor is disposedbetween the circuit component and the frame surface.
 6. The image sensordriving mechanism as claimed in claim 1, wherein the first drivingassembly is disposed on the peripheral area of the first movableassembly.
 7. The image sensor driving mechanism as claimed in claim 1,wherein a width of the first section is greater than a thickness of thefirst section, the width is measured along a direction parallel to theoptical axis, and the thickness is measured along a direction that isperpendicular to the optical axis.
 8. The image sensor driving mechanismas claimed in claim 7, wherein the circuit component has a circuitcomponent surface, continuously arranged on the circuit main body andthe first section, wherein the circuit component surface on the circuitmain body faces the image sensor, and the circuit component surface onthe first section is parallel to the optical axis.
 9. The image sensordriving mechanism as claimed in claim 8, wherein the circuit componentfurther comprises a second section, and the extending direction of thesecond section is different than the extending direction of the firstsection.
 10. The image sensor driving mechanism as claimed in claim 8,wherein the first section is disposed on the peripheral area of thefirst movable assembly, and the first section and the first movableassembly partially overlap as seen from a direction that isperpendicular to the optical axis.
 11. The image sensor drivingmechanism as claimed in claim 8, further comprising an additional firstsection, and the first section and the additional first section aredisposed on two sides of the first movable assembly.
 12. The imagesensor driving mechanism as claimed in claim 11, wherein the circuitcomponent further comprises a plurality of second sections disposed onthe two sides of the first movable assembly, and the extendingdirections of the second sections are different than the extendingdirection of the first section.
 13. The image sensor driving mechanismas claimed in claim 7, wherein the fixed assembly further comprises acase, the case has a lateral wall parallel to the optical axis, and thelateral wall and the circuit component partially overlap as seen from adirection parallel to the optical axis.
 14. The image sensor drivingmechanism as claimed in claim 1, further comprising a position detectingassembly, configured to detect the movement of the first movableassembly relative to the fixed assembly.
 15. The image sensor drivingmechanism as claimed in claim 14, further comprising: a second movableassembly, configured to hold an optical member, wherein the secondmovable assembly is movably connected to the fixed assembly; and asecond driving assembly, configured to drive the second movable assemblyto move relative to the fixed assembly, wherein the position detectingassembly has a magnetic force sensor, disposed on the first movableassembly and corresponding to a driving magnetic member of the seconddriving assembly.
 16. The image sensor driving mechanism as claimed inclaim 15, wherein the driving magnetic member is disposed on the fixedassembly.